Monday, 15 December 2014

Here's what's inside the thinnest smartphone ever: Vivo X5 Max gets the teardown treatment

Here's what's inside the thinnest smartphone ever: Vivo X5 Max gets the teardown treatment

Here's what's inside the thinnest smartphone ever: Vivo X5 Max gets the teardown treatment 

Although it's not technically the thinnest phone on the market (as it's only been unveiled, not launched yet), the dual-SIM Vivo X5 Max will steal Oppo R5's throne once it lands on the shelves with its extremely-thin unibody, 4.75mm at its "fattest" point and just 3.98mm at the thinnest one.

As curious as we tech-heads usually are, it comes without a doubt that many of you have wanted to take a brief sneak peek inside the Vivo X5 Max and its hardware components, which are surely packed like sardines.
Well, we have been curious to check its insides, too, and fortunately, we can now do so. A relatively-extensive teardown of the runway star just surfaced, treating us to almost all of its hardware components. It seems that the motherboard of the phone itself is merely 1.7mm thick, or merely half of the width of the 3.5mm audio jack that has also made the cut and has found its way in the phone, which is quite curious when you take into account that the runner-up in the "thinnest phone" race, the Oppo R5, is devoid of a regular audio jack.

You can take a gander at the insides of the thinnest phone in the world right below.

http://www.gizmochina.com/wp-content/uploads/2014/10/2014101500475820399.jpghttp://img5.pcpop.com/ArticleImages/picshow/900x675/20140827/2014082716282116925.jpghttp://thefusejoplin.com/wp-content/uploads/2014/12/Vivo-Xshot-Smartphone.jpg

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